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Amalebula Ezingubo Zerabha L-S5512

I-L-S5512 iyithegi ye-silicone ye-RFID. Le lebula yezingubo zerabha ye-silicone yenziwe ngezinto ze-silicone, ezingangeni manzi, ezingangeni umswakama, ezingashisi kakhulu futhi ezingangeni umfutho. Le lebula ye-silicone ye-RFID iphinde ibe yithegi ye-RFID eqinile engaqinisekisa impilo yesevisi yezikhathi zokuwasha zezimboni ezingaphezu kuka-250. I-L-S5512 inhle futhi ithambile, kulula ukuyifaka. Amalebula ezingubo zerabha ye-silicone aphephile, awanobuthi, awagugi futhi ahlala isikhathi eside, ilebula ye-elekthronikhi eluhlaza eklanyelwe izinkambu zobungcweti ezifana nomkhakha wokunyathelisa indwangu nokudaya, imboni yokuwasha, ezokuthutha zezokwelapha, futhi ingasetshenziswa nakwezinye izikhathi zokushisa okuphezulu, umswakama ophezulu, amandla aphezulu abasebenzi kanye nezinye izikhathi zokusebenza.

Xhumana nathi LANDA I-DATASHEET

Ukuhlukanisa

Izinto Zokumaka	I-FPC
Izinto Zomphezulu	I-Silicone
Ubukhulu	55 x 12 x 2.5 mm
Ukufakwa	Thunga umphetho noma ilebula elukiwe
Ukumelana Nokushisa	Ukugeza: 90℃, imizuzu eyi-15, imijikelezo engama-250 Ukomisa kusengaphambili: 180℃, imizuzu engama-30 Uku-ayina: 180℃, imizuzwana eyi-10, imijikelezo engama-250 Ukuhlanza: 135℃, imizuzu engama-20
Ukuhlukaniswa kwe-IP	I-IP68
Ukumelana namakhemikhali	Amakhemikhali avamile avamile ezinqubweni zokugeza
Ukumelana Nemishini	Amabha angu-20
Iwaranti	Iminyaka emi-2 noma imijikelezo yokuwasha engu-250
Iphrothokholi Yomoya ye-RF	I-EPC Global Class 1 Gen2 ISO18000-6C
Imvamisa Yokusebenza	I-UHF 860-960 MHz
Ukuhambisana Kwemvelo	Kulungiselelwe emoyeni
Funda Ububanzi	Kufika ku-9.5 m (emoyeni)
Uhlobo lwe-IC	Impinj R6P
Ukucushwa Kwememori	Umsebenzisi we-EPC 128 bit ongu-32bit

Ishadi lokuhlola ukusebenza ku-Voyantic:

Incazelo Yomkhiqizo

Ilebula yerabha yezingubo yakhiwe nge-antenna yethusi ku-substrate ye-FPC kanye ne-chip ye-UHF kuphakheji ye-QFN. I-chip ye-UHF kuphakheji ye-QFN kanye ne-antenna yethusi kuxhunywe ngogesi ukuze kwakhiwe i-inlay yomsebenzi wokuhlonza imvamisa yomsakazo ongasebenzi. Umsebenzi we-RFID ongasebenzi owakhiwa yi-antenna yethusi ku-substrate ye-FPC kanye ne-chip ye-UHF kuphakheji ye-QFN uyi-inlay evalwe endlini yerabha ye-silicone evikelwe ukuze kufezwe ukuvikelwa kokwelapha kwe-silicone. Amathegi ethu erabha ezingubo, njenge-L-S5512 enza kube nokwenzeka ukuthuthukisa nokuvikela kakhulu ukuzinza kwethegi ye-RFID ye-inlay ezindaweni ezinzima zomzimba nezamakhemikhali ngokuvikela i-epoxy i-antenna yethusi esekelwe ku-FPC kanye ne-chip ye-UHF evikelwe yi-QFN ngaphakathi kwegobolondo lerabha ye-silicone evikelwe, okwenza amalebula ezingubo ze-RFID akwazi ukuzivumelanisa nezidingo zokushisa okuphezulu kanye nengcindezi, amandla aqinile okunamathela kanye nokuphambuka okuphezulu, ukugqwala okunamandla kanye nezinye izindawo zokuwasha.

incazelo2

I-RTEC RFID