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Iileyibhile zempahla zerabha L-S5512

I-L-S5512 yithegi ye-silicone ye-RFID. Le lebhile yempahla yerabha ye-silicone yenziwe ngezinto ze-silicone, ezingangeni manzi, ezingangeni kumswakama, ezishushu kakhulu kwaye zingangeni kuxinzelelo. Le lebhile ye-silicone ye-RFID ikwayithegi eqinileyo ye-RFID enokuqinisekisa ubomi benkonzo obungaphezulu kwamaxesha okuhlamba emizi-mveliso angama-250. I-L-S5512 intle kwaye ithambile, kulula ukuyifaka. Iilebhile zempahla yerabha ye-silicone zikhuselekile, azinatyhefu, azigugi kwaye zihlala ixesha elide, ilebhile eluhlaza ye-elektroniki eyenzelwe amacandelo obuchwephesha afana noshishino lokuprinta ilaphu kunye nokudaya, ishishini lokuhlamba, uthutho lwezonyango, kwaye ingasetyenziselwa nezinye iimeko zobushushu obuphezulu, ukufuma okuphezulu, amandla aphezulu okusebenza kunye nezinye iziganeko zokusebenza.

Qhagamshelana nathi KHUPHELA I-DATASHEET

Ukwahlulwahlulwa

Izinto zeTag	I-FPC
Izinto ezisetyenziswa kumphezulu	I-silicone
Ubukhulu	55 x 12 x 2.5 mm
Ufakelo	Thunga umphetho okanye ilebhile elukiweyo
Ukumelana nobushushu	Ukuhlamba: 90℃, imizuzu eli-15, imijikelo engama-250 Ukomisa kwangaphambili: 180℃, imizuzu engama-30 Uku-ayina: 180℃, imizuzwana eli-10, imijikelo engama-250 Ukubulala iintsholongwane: 135℃, imizuzu engama-20
Udidi lwe-IP	IP68
Ukumelana neekhemikhali	Iikhemikhali eziqhelekileyo ezisetyenziswa kwiinkqubo zokuhlamba
Ukumelana noomatshini	Iibhari ezingama-20
Iwaranti	Iminyaka emi-2 okanye imijikelo yokuhlamba engama-250
Iprotocol yoMoya weRF	Iklasi ye-EPC Global 1 Gen2 ISO18000-6C
Isantya sokuSebenza	I-UHF 860-960 MHz
Ukuhambelana kweNdalo	Ilungiselelwe emoyeni
Funda Uluhlu	Ukuya kuthi ga kwi-9.5 m (emoyeni)
Uhlobo lwe-IC	Impinj R6P
Uqwalaselo lweMemori	Umsebenzisi we-32bit ye-EPC eyi-128 bit

Itshathi yovavanyo lokusebenza kwiVoyantic:

Ingcaciso yeMveliso

Ileyibhile yerabha yempahla yenziwe nge-antenna yobhedu kwi-substrate ye-FPC kunye ne-chip ye-UHF kwiphakheji ye-QFN. I-chip ye-UHF kwiphakheji ye-QFN kunye ne-antenna yobhedu ziqhagamshelwe ngombane ukwenza i-inlay yomsebenzi wokuchonga i-frequency yerediyo engashukumiyo. Umsebenzi we-RFID ongashukumiyo owenziwe yi-antenna yobhedu kwi-substrate ye-FPC kunye ne-chip ye-UHF kwiphakheji ye-QFN yi-inlay evalwe kwi-silicone raber vulcanized housing ukuze kufezekiswe ukhuseleko lokuphilisa lwe-silicone. Iithegi zethu zerabha zempahla, ezifana ne-L-S5512 zenza kube nokwenzeka ukuphucula kakhulu nokukhusela uzinzo lwe-RFID tag kwiindawo ezinzima zomzimba nezekhemikhali ngokukhusela i-epoxy i-antenna yobhedu esekwe kwi-FPC kunye ne-QFN-encapsulated UHF chip ngaphakathi kwigobolondo yerabha ye-silicone evulcanized, okwenza iileyibhile zempahla ze-RFID zikwazi ngakumbi ukuziqhelanisa neemfuno zobushushu obuphezulu kunye noxinzelelo, amandla okuxinana aqinileyo kunye nokuphambuka okuphezulu, ukugqwala okunamandla kunye nezinye iindawo zokuhlamba.

inkcazo2

I-RTEC RFID